ULTRAFAST HEAT/ROOM TEMPERATURE ADHESIVE COMPOSITION FOR BONDING APPLICATIONS
摘要
<p>The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.</p>
申请公布号
WO2011002876(A2)
申请公布日期
2011.01.06
申请号
WO2010US40587
申请日期
2010.06.30
申请人
HENKEL CORPORATION;LEVANDOSKI, SUSAN, L.;LITKE, ALAN, E.;LOVE, TERESA, A.
发明人
LEVANDOSKI, SUSAN, L.;LITKE, ALAN, E.;LOVE, TERESA, A.
