PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE INKJET INK USING THE SAME, PHOTOSENSITIVE ADHESIVE, PHOTOSENSITIVE COATING AGENT, AND SEMICONDUCTOR SEALING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having an excellent curing property that curing is not suppressed by humidity of which the cured product has a film physical property being excellent in toughness and flexibility.SOLUTION: The photosensitive resin composition includes a compound (a) represented by formula (1) (wherein Rrepresents 1-5C alkyl, 5-10C cycloalkyl, 1-5C alkoxy, halogen, hydroxyl, aryl or aralkyl; mrepresents an integer of 2-5; and nrepresents an integer of 0-20).