发明名称 |
DEVICE AND METHOD FOR PRESS-BONDING COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for press-bonding a component capable of easily and promptly changing arrangement of a plurality of press-bonding units each including a press-bonding head and an edge support member, and performing efficient component press-bonding in accordance with the arrangement of component press-bonding positions at an edge of a board, in component press-bonding to a board having a component mounting region at an edge thereof.SOLUTION: This device for press-bonding a component includes: a plurality of press-bonding units each including a press-bonding head for press-bonding a component to a component press-bonding region of a board and an edge support member for supporting an edge of the board in press-bonding and arranged on a line; a guide support member for supporting the respective press-bonding units to be capable of guiding movement in a direction along the edge of the board in which the press-bonding is executed; a common head lifting device for integrally vertically moving the respective press-bonding heads; and a plurality of unit movement devices individually provided for the plurality of press-bonding units for moving the press-bonding units along the edge to change the arrangement of the press-bonding units. |
申请公布号 |
JP2011003646(A) |
申请公布日期 |
2011.01.06 |
申请号 |
JP20090144246 |
申请日期 |
2009.06.17 |
申请人 |
PANASONIC CORP |
发明人 |
KATAYAMA ATSUSHI;IGARASHI CHIHIRO |
分类号 |
H01L21/60;H01L21/603;H05K3/36 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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