发明名称 |
LEAD FRAME ROUTED CHIP PADS FOR SEMICONDUCTOR PACKAGES |
摘要 |
A redistributed lead frame for use in a molded plastic semiconductor package is formed from an electrically conductive substrate by a sequential metal removal process. The process includes patterning a first side of the substrate to form an array of lands separated by channels; disposing a first molding compound within those channels; patterning a second side of the substrate to form an array of chip attach sites and routing circuits electrically interconnecting the array of lands and the array of chip attach sites; directly electrically interconnecting input/output pads on a semiconductor device to the chip attach sites; and encapsulating the semiconductor device, the array of chip attach sites and the routing circuits with a second molding compound. This process is particularly suited for the manufacture of chip scale packages and very thin packages.
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申请公布号 |
US2011001224(A1) |
申请公布日期 |
2011.01.06 |
申请号 |
US20100843183 |
申请日期 |
2010.07.26 |
申请人 |
SAN ANTONIO ROMARICO SANTOS;SUBAGIO ANANG;ISLAM SHAFIDUL |
发明人 |
SAN ANTONIO ROMARICO SANTOS;SUBAGIO ANANG;ISLAM SHAFIDUL |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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地址 |
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