发明名称 MEMORY CHIP PACKAGE DEVICE AND METHOD OF OPERATION THE SAME
摘要 PURPOSE: A memory chip packaging device and a method for operating the same are provided to overcome power supplying related problems by supplying power from non-operating memory chips to operating memory chips. CONSTITUTION: A first memory chip and a second memory chip are respectively selected in response with a first chip address and a second chip address. An operation controller(211) outputs an internal power enable signal and a voltage request signal according to a chip enable signal. A voltage controller(212) outputs a voltage generating enable signal in order to generate internal power. A first voltage path selector(214) supplies the voltage of an output node to an internal circuit according to a first path enable signal. A second voltage path selector(215) transfers the internal power to the output node according to a second path enable signal.
申请公布号 KR20110001078(A) 申请公布日期 2011.01.06
申请号 KR20090058469 申请日期 2009.06.29
申请人 HYNIX SEMICONDUCTOR INC. 发明人 SEONG, JIN YONG
分类号 G11C5/06;G11C5/14;G11C8/04 主分类号 G11C5/06
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