REACTIVE HOT-MELT ADHESIVE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a reactive hot-melt adhesive which sufficiently bonds highly polar resin such as a polycarbonate resin even when applied by melting at a high temperature around 200°C.SOLUTION: The reactive hot-melt adhesive composition includes a rubber, a crosslinkable silyl-containing organic polymer, and a compound having at least two alkoxysilyl groups per molecule.