| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that improves inductor performance, while securing the mechanical strength of a semiconductor substrate, and to provide a method of manufacturing the same.SOLUTION: The semiconductor device includes the semiconductor substrate, an active element formed in the first region of the semiconductor substrate, an inductor element formed above the second region of the semiconductor substrate different from the first region, and a trench part having a plurality of trenches formed in the backside of the semiconductor substrate in the second region, wherein the plurality of trenches are formed radially from a position corresponding to the center of the inductor element. |
