| 发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| 摘要 |
An insulation is provided in a portion surrounding a light receiving portion in a semiconductor element, and a sealing resin is provided around the insulation, thereby warping the insulation outward when viewed from the light receiving portion to prevent diffuse light from returning to the light receiving portion of the semiconductor element.
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| 申请公布号 |
US2011001208(A1) |
申请公布日期 |
2011.01.06 |
| 申请号 |
US20090918023 |
申请日期 |
2009.02.26 |
| 申请人 |
|
发明人 |
FURUYASHIKI JUNYA;YOSHIKAWA NORIYUKI;FUKUDA TOSHIYUKI;ITOOKA TOSHIMASA;UTATSU HIROKI |
| 分类号 |
H01L31/0203;H01L31/18;H01L35/22 |
主分类号 |
H01L31/0203 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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