CAMERA MODULE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A camera module and a manufacturing method thereof capable of miniaturization of the camera module are provided to minimize the height of the camera by removing the influence of the image sensor height about the overall height of the camera module. CONSTITUTION: One or more sensor pads is formed in the outside of the upper side of an image sensor(140). The image sensor is installed in the center of the upper part of an FPC(Flexible Printed Circuit). Each electronic device is installed to the FPC. An opening part is formed in the center of a PCB(Printed Circuit Board)(150). One or more PCB pads is installed inside the wall of the PCB. The PCB is attached to the top of the FPC.