A high density digital signal cross-connect module is disclosed. A plurality of jacks are carried on the module and disposed with jack sleeves being in generally horizontal aligned positions. The jacks are disposed in a vertical column in side-by-side relation. The orientation of the jacks permits a higher DSX density in the module.
申请公布号
US5078624(A)
申请公布日期
1992.01.07
申请号
US19910706392
申请日期
1991.05.28
申请人
ADC TELECOMMUNICATIONS, INC.
发明人
BURROUGHS, DENNIS M.;SANSONE, EDWARD F.;TREBESCH, STEVEN P.;RIVERA, SR., DANIEL;BUTLER, RONALD G.;THORGRIMSON, GLENN N.
