| 摘要 |
PROBLEM TO BE SOLVED: To build an electronic component in a wiring board using a simple process, and to have the electronic component interlayer-connect by the simple process.SOLUTION: The upper component of an electrode pad 1a for an interlayer connection formed to one surface of a first board 2; the upper parts of the electrode pads 1b and 1c for mounting the electronic component are coated with solder paste respectively; and a solder ball is mounted on solder paste coated on the electrode pad for interlayer connection while the electronic component 9 is mounted on solder paste coated on the electrode pads for mounting the electronic component. A solder bump 10 is formed by a reflow, while the electronic component 9 is mounted and soldered; and an interlayer insulating sheet 11 is stuck on one surface of the first board, while coating the solder bump and the electronic component. The interlayer insulating sheet on the solder bump is irradiated with a laser and the upper component 10a of the solder bump is exposed, and a second board 12 is laminated on the interlayer insulating sheet and the electrode pad 13a for interlayer connection formed on the second board and the upper component10a of the solder bump are connected. |
