发明名称 Method for producing insulation structures
摘要 To form an isolation structure in a semiconductor substrate, at least two trenches are formed with a rib therebetween in the semiconductor substrate, and then the semiconductor material in the area of the trenches and particularly the rib is converted to an electrically insulating material. For example, this is accomplished by thermal oxidation of silicon semiconductor material of the rib.
申请公布号 US7862731(B2) 申请公布日期 2011.01.04
申请号 US20050527789 申请日期 2005.08.09
申请人 CONTI TEMIC MICROELECTRONIC GMBH 发明人 AIKELE MATTHIAS;ENGELHARDT ALBERT;FREY MARCUS;SCHMID BERNHARD;SEIDEL HELMUT
分类号 H01L21/302;B81C1/00 主分类号 H01L21/302
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