发明名称 METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE
摘要 The invention relates to a method of forming a molded surface on a substrate (32) using a stamping tool (34) having at least a portion that is translucent, said method comprising pressing said stamping tool (34) into a layer (30) of moldable material on said substrate (32); directing a curing stimulus through at least a portion of said translucent portion of said stamping tool (34), wherein at least a portion of said moldable material (30) is cured.
申请公布号 KR101005246(B1) 申请公布日期 2011.01.04
申请号 KR20087029288 申请日期 2002.02.06
申请人 发明人
分类号 B81C1/00;H01L23/48;B81B3/00;G01R1/04;G01R1/067;G01R1/073;G01R3/00;H01H11/04;H01L21/768;H01L23/482;H01R13/24;H05K3/40;H05K7/10 主分类号 B81C1/00
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