| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to reduce the amount of fillers for spaces around stacked semiconductor chips by installing a dam. CONSTITUTION: Semiconductor chips(150a, 150b, 150c) are stacked on a substrate(100) through a through electrode(130). The through electrode is in electric connection with a bond finger(122) on the substrate. A dam(160) is formed along the lateral side of the stacked semiconductor chips. Fillers fill spaces around the stacked semiconductor chips, the dam, and the substrate in order to form a filing part(135). The height of the dam is identical to or higher than the heights of the stacked semiconductor chips.
|
