THROUGH HOLE ELECTRODE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A through hole type electrode and a forming method thereof are provided to reduce the time of an electrolyte plating process by reducing the distance of an electrode growth by filling a part of a through hole with a conductive paste. CONSTITUTION: A through hole is formed in a substrate(10) by a dry etching process. A conductive paste(60) is filled in the lower part of the through hole. A metal layer(40) is formed in the bottom side of the substrate in which the conductive paste is filled. A protective layer is attached to the surface of the metal layer. An inner electrode(50) is formed in the through hole by using the metal layer as a seed layer.