发明名称 |
METHOD FOR PRODUCING AN EPITAXIALLY COATED SEMICONDUCTOR WAFER |
摘要 |
PURPOSE: A method for producing an epitaxially coated semiconductor wafer is provided to improve the nanotopography by preventing striation on the epitaxially coated semiconductor wafer. CONSTITUTION: An epitaxial layer is evaporated in one side of a semiconductor wafer. The epitaxial coating side of the semiconductor wafer is polished by using the polishing pad having fixed abrasive. The epitaxial coating side of the semiconductor wafer is CMP polished by using the polishing pad of the soft without the fixed abrasive.
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申请公布号 |
KR20100138747(A) |
申请公布日期 |
2010.12.31 |
申请号 |
KR20100050323 |
申请日期 |
2010.05.28 |
申请人 |
SILTRONIC AG |
发明人 |
SCHWANDNER JUERGEN;KOPPERT ROLAND |
分类号 |
H01L21/20;B24B37/04;H01L21/304 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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