| 摘要 |
PURPOSE: A method for producing a semiconductor wafer is provided to guarantee the flexibility greater than the requirement by the customers by arbitrarily controlling the roughness of the back of a wafer within large range. CONSTITUTION: A semiconductor wafer is prepared by transferring a silicon rod to the wafer. The edge of a semiconductor wafer is processed so that the front and the back comprise the tilted round surface. The front and the back of the semiconductor wafer are polished. The polishing process of the front of the semiconductor wafer includes the polishing process using a polishing pad without the abrasive.
|
