| 摘要 |
PURPOSE: A double sided polishing method of a semiconductor wafer is provided to polish the back of a semiconductor wafer using a polishing pad without the abrasive while polishing the front of the semiconductor using the polishing pad. CONSTITUTION: The front side of the semiconductor wafer is polished by using the polishing pad having fixed abrasive. The back of the semiconductor wafer is polished using the polishing pad without the abrasive. The polishing agent containing the abrasive is introduced between the back side of the semiconductor wafer and the polishing pad.
|
