发明名称 |
Verfahren zur Herstellung eines mehrschichtigen elektronischen Bauelementes und mehrschichtiges Bauelement |
摘要 |
A multilayered electronic component that is easy to manufacture and that has satisfactory electrical characteristics is provided. End portions of the coil wiring patterns that oppose a coil connection electrode are displaced on the surface of a second ceramic layer due to an increase or decrease in the number of first ceramic layers. A coil connection electrode has a shape in which surface portions of second ceramic layers or second ceramic layers opposing with the first ceramic layers disposed in between are connected to the end portions of the coil wiring patterns that oppose the respective coil connection electrode, which are displaced due to the increase or decrease in the number of the first ceramic layers. A connection wiring pattern has a shape in which one portion of a coil connection electrode is connected to one portion of an external extension electrode connection pattern. |
申请公布号 |
DE602004030085(D1) |
申请公布日期 |
2010.12.30 |
申请号 |
DE20046030085T |
申请日期 |
2004.12.03 |
申请人 |
MURATA MFG. CO. LTD. |
发明人 |
MAEDA, TOMOYUKI;MATSUSHIMA, HIDEAKI |
分类号 |
H01F17/00;H01F41/04;H01F17/03;H01F27/28 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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