A METHOD FOR PLATING A COPPER INTERCONNECTION CIRCUIT ON THE SURFACE OF A PLASTIC DEVICE

摘要

There is disclosed a method for plating a copper interconnection circuit on the surface of a plastic device. The method comprises a step of depositing an activation layer on the outer surface of the plastic device and a step of plating with copper the outer surface of the plastic device, the activation layer activating plating where copper is needed. The method comprises a step of laser structuring the outer surface of the plastic device, in order to remove the activation layer locally where copper is not needed. Application : highly integrated electronics