发明名称 |
Method of electrolessly depositing metal on the walls of through-holes |
摘要 |
Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
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申请公布号 |
US7858146(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20070824222 |
申请日期 |
2007.06.29 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
POOLE MARK A.;COBLEY ANDREW J.;SINGH AMRIK;BASS KEVIN |
分类号 |
B05B7/22 |
主分类号 |
B05B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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