发明名称 Method of electrolessly depositing metal on the walls of through-holes
摘要 Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
申请公布号 US7858146(B2) 申请公布日期 2010.12.28
申请号 US20070824222 申请日期 2007.06.29
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 POOLE MARK A.;COBLEY ANDREW J.;SINGH AMRIK;BASS KEVIN
分类号 B05B7/22 主分类号 B05B7/22
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