发明名称 |
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.
|
申请公布号 |
US7859099(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20080333297 |
申请日期 |
2008.12.11 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
CHOI A LEAM;CHUNG JAE HAN;YANG DEOKKYUNG;PARK HYUNGSANG |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|