发明名称 METHOD FOR LOW-TEMPERATURE FAST FORMING OF SI THIN FILM AND APPARATUS FOR MANUFACTURING THE SAME
摘要 PURPOSE: A method and an apparatus for low-temperature and high-speed depositing a silicon thin film are provided to obtain the light temperature gradient between a substrate and a chamber by cooling the substrate in a silicon thin film depositing process. CONSTITUTION: A silicon source gas is introduced in a chamber(10). A chamber heating part(12) heats the chamber by being installed in the chamber. A substrate supporting part is mounted in the chamber. The substrate supporting part supports a substrate on which a silicon thin film is deposited. The silicon thin film is deposited on the substrate by heating and thermally decomposing the silicon source gas.
申请公布号 KR20100135532(A) 申请公布日期 2010.12.27
申请号 KR20090053969 申请日期 2009.06.17
申请人 POSTECH ACADEMY-INDUSTRY FOUNDATION 发明人 JO, MOON HO;LEE, GEUN HEE;LEE, DONG HUN
分类号 H01L21/205;C23C16/52 主分类号 H01L21/205
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