METHOD FOR DIVIDING BRITTLE MATERIAL SUBSTRATE

摘要

PURPOSE: A method for cutting a brittle material substrate capable of simple separation is provided to control the generation of microcracks and cullet without complication of an apparatus. CONSTITUTION: A method for cutting a brittle material substrate comprises the steps of: forming early cracks(31) at a starting point(As) of a cutting line(11) with a cutter wheel(2) on the surface(10a) of a glass substrate(1); forming early penetrating crack on the rear side(10b) of the glass substrate by pressing the part facing the early cracks with a brake roller(4); irradiating laser beams(51) along the cutting line to heat the glass substrate to less than a melting temperature; and proceeding initial penetrating cracks along the cutting line through thermal stress.