| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a double-sided circuit board having a through hole at a high yield. SOLUTION: A method for manufacturing the double-sided circuit board includes preparing an insulating substrate 11, forming a first hole 13a and a second hole 14a on the first and second surface sides of the insulating substrate 11 respectively, then forming a through hole 150 through the insulating substrate 11 by forming a third hole 15 connecting the first hole 13a to the second hole 14a in the insulating substrate 11, forming conductor patterns 12a, 12b on the first surface and second surface of the insulating substrate 11 respectively, and forming a through hole conductor 160 to electrically connect the conductor pattern 12a to the conductor pattern 12b by filling the through hole 150 with a conductive substance. The first hole 13a has a first opening 13b with a diameter R1 on the first surface of the insulating substrate 11, the second hole 14a has a second opening 14b with a diameter R2 on the second surface of the insulating substrate 11, and the diameter of the third hole 15 is smaller than R1 and R2. COPYRIGHT: (C)2011,JPO&INPIT
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