| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a power semiconductor module, and to provide the power semiconductor module with a connection device. <P>SOLUTION: This invention relates to the method and the power semiconductor module manufactured by the method and including a substrate 10, a connection device and a plurality of load terminal elements 50, wherein at least one power semiconductor component is arranged on the conductor path of the substrate 10 and connected to at least one load terminal element by means of the connection device. Further, the power semiconductor component module has auxiliary contact pads 460 to be connected to an external printed circuit board 60. In a production step, respective first contact areas 420 of a first conductor path 42 are simultaneously or sequentially cohesively connected to at least one second contact area 200 of the power semiconductor component 20 and at least one third contact area 500 of the load terminal element. Then, an assemblage composed of at least one power semiconductor component of the connection device and the load terminal elements is arranged to form the housing 30 of the power semiconductor module. <P>COPYRIGHT: (C)2011,JPO&INPIT |
