| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting diode that has high electric insulation and is superior in heat dissipation, and to provide a method of manufacturing the same. <P>SOLUTION: The substrate 1 for mounting the light emitting diode includes a metal substrate 2 made of an Fe-Cr-Al-based stainless steel plate, and an electric insulating layer 3 covering the metal substrate 2, wherein the electric insulating layer 3 is formed by laminating a ground insulating layer 4 and a surface insulating layer 5 from the side of the metal substrate 2. Here, the ground insulating layer 4 is formed of an aluminum oxide film and has a thickness of 0.3 to 1 μm and a center line average roughness (Ra) of 300 to 500 nm, and the surface insulating layer 5 is formed of a metal oxide film and has a thickness of 0.3 to 1 μm. <P>COPYRIGHT: (C)2011,JPO&INPIT |
