| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition that gives a cured product exhibiting excellent heat-resistant adhesive properties, adhesive properties, soldering heat resistance, and processability and is suitably applicable to FPC in particular, and to provide an adhesive sheet and a cover-lay film obtained using the composition. <P>SOLUTION: The adhesive composition comprises (A) an epoxy resin, (B) a carboxy group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (D) an inorganic filler, and (E) a specific sulfur-containing hindered phenol deterioration-preventing agent, wherein the compounded amount of the component (E) is 1-30 mass% based on the amount of component (B). The adhesive sheet comprises a release substrate and an adhesive layer comprising the composition formed on the substrate. The cover-lay film comprises an electrically insulating film and an adhesive layer comprising the composition formed on the film. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
