发明名称 LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 <p>Disclosed is a laminated ceramic electronic component provided with a laminate having internal electrodes such that it is possible to reduce the likelihood of changes in state such as electrode breakage and ball formation and to improve DC bias characteristics during the firing process in which the laminate is sintered, even when the ceramic layer and the internal electrodes are thinned. With reference to the grain diameter of the ceramics that form the ceramic layers, the laminate (12) is divided into a large grain area (13) in which the grain diameter is relatively large and into a small grain area (14) in which the grain diameter is relatively small. The large grain area (13) is positioned on the outside of the small grain area (14) and the boundary (15) of the large grain area and the small grain area is positioned inside the outer surface of the laminate so as to enclose the area (16) where the internal electrodes of the laminate are present. In order to obtain the laminate, the firing process involves a heat treatment in a temperature profile in which the average rate of temperature increase from room temperature to the maximum temperature is 40°C/sec or more.</p>
申请公布号 WO2010146967(A1) 申请公布日期 2010.12.23
申请号 WO2010JP58618 申请日期 2010.05.21
申请人 MURATA MANUFACTURING CO., LTD.;HIRATA, YOSUKE;TSUJI, HIDEAKI;OMORI, NAGATO;WADA, HIROYUKI;HIRAMATSU, TAKASHI;SAITO, YOSHITO 发明人 HIRATA, YOSUKE;TSUJI, HIDEAKI;OMORI, NAGATO;WADA, HIROYUKI;HIRAMATSU, TAKASHI;SAITO, YOSHITO
分类号 H01G4/30;H01G4/12;H01G13/00 主分类号 H01G4/30
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