ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE

摘要

A highly reliable connection structure is configured at low cost by means of a simplified production process by connecting a connection electrode having an organic film serving as an antioxidization coating using a conductive adhesive. An electrode connection method for connecting a first connection electrode (2) and a second connection electrode (10) by means of a conductive adhesive (9) interposed between the electrodes includes an organic film formation step of providing an organic film (6) at least to the surface of the first connection electrode and an electrode connection step of connecting the first connection electrode and the second connection electrode using the conductive adhesive. At the electrode connecting step, the organic film decomposing component mixed in the conductive adhesive is caused to act on the organic film, thereby the organic film is decomposed, and the connection electrodes are connected.