| 摘要 |
A method to fabricate an integrated electronic circuit includes superimposing insulating layers and metal elements distributed within said insulating layers. Each insulating layer comprises a first level within which the metal elements lie substantially in the plane of the first level, and a second level traversed by the metal elements in a direction substantially perpendicular to the plane of the second level, so as to come into contact with at least one metal element of the first level. The levels also comprise insulation zones for insulating the metal elements from each other. In one insulating layer, at least one of the levels comprises at least two insulation zones respectively realized of a first material and a second material which are different from each other.
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