| 摘要 |
<p>The present invention relates to an LED array module and a fabrication method thereof which can freely configure a circuit in serial and parallel for a plurality of LEDs by forming radiation blocks into an upper conductive layer and a lower conductive layer and partitioning each layer into multiple slices, thereby managing various output requirements, in an LED module which has radiation blocks which function to radiate the high-temperature heat generated by the emission of the LEDs by attaching the LEDs to the radiation blocks without using a printed circuit board (PCB). The present invention comprises: a first step (S100) of laminating and fixing an upper conductive layer (100) and a lower conductive layer (200) by an insulation bonding layer (300); a second step (S200) of forming an insulating layer (110) on the surfaces of the upper conductive layer (100) and the lower conductive layer (200) which are exposed to the outside; a third step (S300) of forming a plurality of LED mounting surfaces (120) by processing the upper conductive layer (100) to expose the upper surface of the lower conductive layer (200); a fourth step (S400) of mounting LEDs (400) on the respective LED mounting surfaces (120) to supply the power through the upper conductive layer (100) and the lower conductive layer (200) which are exposed to the inside of the respective LED mounting surfaces (120); a fifth step (S500) of molding the LED mounting surfaces (120) with resins (500) having insulating and transparent properties; and a sixth step (S600) of processing an upper separation groove (130) and a lower separation groove (220) side by side in the width direction so that the upper conductive layer (100) and the lower conductive layer (200) are respectively partitioned into a plurality of slices (100a, 200a).</p> |
