Structure for multi-row leadless lead frame and semiconductor package thereof and manufacture method thereof

摘要

PURPOSE: A manufacturing method of a multi-row leadless frame for a semiconductor package and semiconductor package using the same forms the carrier material into a carrier metal layer, a bonding layer, and a multilayer structure of a metal support layer. The ultra thin multi-row leadless frame is manufactured. CONSTITUTION: Pattern is formed in the carrier layer for the lead frame. The surface process is enforced on the same pattern. The carrier layer has the carrier metal layer(30), the bonding layer(20), and the multilayer structure of the metal support layer(10). It is formed in the carrier layer through the coating of the photosensitive material, and exposure and phenomenon. The surface process is included among plating, evaporation, and printing.