| 摘要 |
PURPOSE: An LED package manufacturing method is provided to improve the brightness of the light by forming a reflection layer of white to cover a side, inner side of a cavity, and a bottom. CONSTITUTION: An emitting device(48) is mounted on a substrate(40). A cavity(42) of a predetermined depth is formed on the middle of the substrate. The pattern electrodes(44, 46) are formed on the bottom of the cavity. The fluorescent substance mixed solution is dispensed on the top of the mounted light emitting device.
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