PACKAGE OF OPTICAL ELEMENT AND SUBSTRATE INCLUDING THE SAME

摘要

PURPOSE: A package of an optical element and a substrate including the same are provided to increase optical connection efficiency by reducing the gap between an optical device and an optical waveguide. CONSTITUTION: A carrier substrate(210) has a terminal unit in one side. An optical device(220) is mounted in the surface of the carrier substrate. An optical device driving chip(230) is mounted in the carrier substrate. A resin suture layer is formed on the carrier substrate to cover the optical device driving chip.