METHOD FOR DIVIDING BONDED SUBSTRATE AND BONDED SUBSTRATE

摘要

PURPOSE: A method for dividing a laminated substrate is provided to divide one side of a laminated substrate by creating thermal stress and to separate an edge member of one substrate from the other substrate. CONSTITUTION: A method for dividing a laminated substrate comprises a step for dividing an edge member(12) which is an end part facing one substrate, from one substrate. The other substrate of a laminated substrate comprises 2 substrates made of brittle materials. Spacers(5) are arranged between the edge member and the other substrate in an interval of 3mm or less.