| 摘要 |
PURPOSE: A manufacture method for a multi-row leadless lead frame and a semiconductor package are provided to reduce manufacturing costs and high productivity by using a resistor having lower exfoliation as a photoresist and an etching resistor and a resistor having high exfoliation as a photoresist. CONSTITUTION: In a manufacture method for a multi-row leadless lead frame and a semiconductor package, resistor layers are formed by a metal member and are selectively exfoliated after exposure and electroplating(ST1, ST2, T3, ST4, ST5). A lead frame of multiple strings is formed by exfoliating an lower part of the flame after first etching(ST6, ST7). |
