Chip stacked package and method for manufacturing of it,申请号KR20090039722-传众专利搜索

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发明名称	Chip stacked package and method for manufacturing of it
摘要
申请公布号	KR101002041(B1)	申请公布日期	2010.12.17
申请号	KR20090039722	申请日期	2009.05.07
申请人		发明人
分类号	H01L23/48;H01L21/60	主分类号	H01L23/48
代理机构		代理人
主权项
地址

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