| 摘要 |
<p>Provided is a semiconductor integrated circuit device which has: a semiconductor chip (100) having a plurality of input/output cells (105); a plurality of pads (101, 102) formed on the surface of the semiconductor chip; and wiring lines (103, 104) formed between the pads on the surface of the semiconductor chip, said wiring lines electrically connecting at least some of the input/output cells (105) with at least some of the pads (101, 102). The pads (101, 102) are arranged in a quadrangular grid shape at the center portion of the semiconductor chip, and are arranged in a staggered manner at least on one corner portion of the four corner portions of the semiconductor chip.</p> |
