| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection method for inexpensively achieving an adhesive connection structure while simplifying manufacturing processes, and to provide an electronic apparatus. SOLUTION: A motherboard 20 includes a rigid substrate 21, and an electrode 22 for adhesive connection and an electrode 26 for solder connection that are provided on the rigid substrate 21. Each of surfaces of the respective electrodes 22, 26 is covered with an organic film 25, namely an oxidation inhibition film formed by OSP treatment. When forming solder connection structure D by a solder layer 50, the organic film 25 is thermally decomposed. Then, an electrode 12 and the electrode 22 are connected by an adhesive 30 to form adhesive connection structure C. In this case, the organic film 25 has already been thermally decomposed, so that the respective electrodes 22, 26 easily conduct electricity, thus smoothly forming the solder connection structure and adhesive connection structure. COPYRIGHT: (C)2011,JPO&INPIT
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