| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same that prevent harmful effects due to progression of a bleed-out component in an easy manner without forming a hydrophobic film. SOLUTION: The semiconductor device includes a metal plate having a rolling flaw generated during rolling, an element fixed to the metal plate via an adhesive material, a wire connecting the metal plate and element to each other, and a groove formed by performing press working on the metal plate. Then the groove is arranged so as to stop extension of the bleed-out component of the adhesive material along the rolling flaw to a connection point between the metal plate and wire, and also the groove has deep enough to avoid strain of the metal plate and to stop the extension of the bleed-out component to the connection point. COPYRIGHT: (C)2011,JPO&INPIT
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