| 摘要 |
A semiconductor package and a manufacturing method thereof are provided. A carrier having an adhesion layer is provided. A plurality of chips are disposed on the adhesion layer, wherein an active surface of each chip faces the adhesion layer. A molding compound is formed for encapsulating the chips to form a chip-redistribution encapsulant having a first surface and a second surface, wherein the first surface has a chip area and a peripheral area. The carrier and the adhesion layer are removed, so that the chip-redistribution encapsulant exposes the active surface of each chip. A plurality of solder balls are uniformly formed in the chip area and the peripheral area. The second surface of the chip-redistribution encapsulant is grinded to reduce the thickness of the chip-redistribution encapsulant, wherein the solder balls provide the chip-redistribution encapsulant with a uniform support. The chip-redistribution encapsulant is sawn to form a plurality of packages. |
