| 摘要 |
An frit-sealed device comprising a resistive heating element having an electrically-closed-loop structure and process for frit-sealing a device by using such heating element. The element can be advantageously made of a metal such as Invar(R) and/or Kovar(R). The invention enables hermetic frit sealing with low residual stress in the seal. The invention is particularly advantageous for hermetic sealing of OLED display devices. |
