| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed board mounting many semiconductor relays in high density, which can improve the high frequency/high-speed signal characteristics, and to provide a semiconductor test device that uses the multilayer printed board. <P>SOLUTION: The multilayer printed board has a plurality of spaces formed internally, and a light-receiving element PVD, an MOSFET and a light-emitting diode LED, constituting the semiconductor relay are disposed in each space so that the light-emitting diode LED faces the light-receiving element PVD and the MOSFET. The semiconductor test device uses the multilayer printed board as a pin electronics card constituting a test head. <P>COPYRIGHT: (C)2011,JPO&INPIT |
