METHOD OF MOUNTING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To improve mounting efficiency by effectively using a mounting space by mounting an electronic component constituted as a package having a degree of freedom in a lower space. SOLUTION: A method of mounting a plurality of electronic components on a printed board includes a mounting process of mounting a film package 21 formed by mounting at least one electronic component on a film base on the printed board 2 in a state wherein the film package is bent to straddle a small-sized electronic component 4 mounted on the printed board 2. The film package 21 has an external shape which is rectangular in plan view before being bent, and is provided with sprocket parts 22 having sprocket holes 23 formed at ends of two opposite sides and also with mounting parts to be mounted on the printed board 2 adjacently to the sprocket parts 22. In the mounting process, the film package 21 is mounted on the printed board 2 in the state wherein the respective mounting parts are pressure-bonded to the printed board 2 and the part between the mounting parts is bent in a sectionally channel shape. COPYRIGHT: (C)2011,JPO&INPIT