| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus for heating respective components effectively without generating abnormal discharge or the like. SOLUTION: The substrate treatment apparatus 10 includes a chamber 11 which can be depressurized, a susceptor 12 arranged in the chamber 11, and a shower head 27 arranged on a ceiling of the chamber 11 so as to face the susceptor 12, a focus ring 24 arranged at an upper outer circumference of the susceptor 12, and an infrared ray radiation type ring-shaped heater 26 arranged at a periphery of the focus ring 24. The heater 26 includes an infrared ray radiating body 26a and a quartz ring 26b with an infrared ray radiating body 26a sealed therein, and no member which prevents the radiation of an infrared ray and exists between the focus ring 24 and heater 26. COPYRIGHT: (C)2011,JPO&INPIT
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