发明名称 FLEXIBLE TABE CARRIER PACKAGE AND METHOD OF MANUFACTURING THE SAME AND FLEXIBLE TABE CARRIER
摘要 PURPOSE: A flexible tape carrier package, a manufacturing method thereof, and a flexible tape carrier are provided to prevent the semiconductor device inside the package from being damaged even if the flexible display is bend along horizontal or vertical direction by arranging semiconductor device to be perpendicular to a tape carrier. CONSTITUTION: A tape carrier(300) is made of the insulating material. The tape carrier is a polyimide film(304) having the insulating property and flexibility. A conductor pattern(303) is formed on the polyimide film. A semiconductor device(302) is mounted on the tape carrier in order to be electrically connected with the conductor pattern.
申请公布号 KR20100131135(A) 申请公布日期 2010.12.15
申请号 KR20090049875 申请日期 2009.06.05
申请人 LG INNOTEK CO., LTD. 发明人 PAIK, JEE HEUM
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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