| 摘要 |
PROBLEM TO BE SOLVED: To surely separate a protective tape bonded on a wafer and to prevent breakage of the wafer upon separation. SOLUTION: A peeling tape T2 is bonded to the outer peripheral side surface of the protective tape T1 under an overhung state, and the peeling tape T2 is rewound from this state to separate the protective tape T1; consequently, the protective tape T1 is surely separated from the surface of the wafer W. COPYRIGHT: (C)2007,JPO&INPIT |
