PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE PACKAGE SUBSTRATE

摘要

Provided are a package substrate for mounting a semiconductor element, which has a high degree of freedom in combining packages, a small limitation in pattern design and makes it possible to connect together a top package and a bottom package at a high density in the case of constituting a PoP, and a method for manufacturing such package substrate.  The package substrate for mounting a semiconductor element is provided with: a cavity layer which is provided with a cavity material and an adhesive and penetrates the cavity material and the adhesive; a base layer laminated on the cavity layer by using the adhesive; a cavity section formed by the opening; and a bottomed via hole formed by the through hole.  The cavity layer is provided with an inner layer circuit, a metal film is formed by plating on the inner wall of the bottomed via hole such that the metal film is bonded to the inner layer circuit, and the bottomed via hole is filled with a conductive resin.