发明名称 |
METHOD FOR PREPARING A TANTALUM CARBIDE-BASED THIN FILM USING AN ATOMIC LAYER DEPOSITION PROCESS |
摘要 |
PURPOSE: A method for manufacturing a tantalum carbide-based thin film using an atomic layer deposition process is provided to suppress the gas phase reaction by alternatively injecting a source gas and a reactive gas to a reactor. CONSTITUTION: A method for manufacturing a tantalum carbide-based thin film using an atomic layer deposition process comprises next steps. A material gas and reactive gas are alternatively contacted to a substrate. The tantalum precursor material is used as the material gas. Hydrocarbon/hydrogen mixed gas plasma is used as the reactive gas. The hydrocarbon gas is used as 0.5~2.5% flow rate of the reactive gas total flow rate. The hydrocarbon gas is used as 1~2.5 weight% flow rate of the reactive gas total flow rate. An atomic layer chemical vapor deposition is performed at a pressure of 0.1~2 torr.
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申请公布号 |
KR20100126902(A) |
申请公布日期 |
2010.12.03 |
申请号 |
KR20090045319 |
申请日期 |
2009.05.25 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
RHEE, SHI WOO;CHO, GI HEE |
分类号 |
C23C16/32;C23C16/513;H01L21/205 |
主分类号 |
C23C16/32 |
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